DocumentNumber Date Language TitleTECHAMERICAGEIA-859 2004.08.01 DataManagement-ANSIApproved:August09,2009TECHAMERICAGEIA-4900 2001.11.01 UseofSemiconductorDevicesOutsideManufacturers麓SpecifiedTemperatureRangesTECHAMERICAGEIA-GEB-0002 2003.11.01 ReducingtheRiskofTinWhisker-InducedFailuresinElectronicEquipmentTECHAMERICAGEIA-HB-0005-2 2007.11.01 TechnicalGuidelinesforAerospaceandHighPerformanceElectronicSystemsContainingLead-freeSolderandFinishesTECHAMERICAGEIA-HB-0005-1 2006.06.01 ProgramManagement/SystemsEngineeringGuidelinesForManagingTheTransitionToLead-FreeElectronicsTECHAMERICAGEIA-HB-0005-3 2008.09.01 Rework/RepairHandbooktoAddresstheImplicationsofLead-FreeElectronicsandMixedAssembliesinAerospaceandHighPerformanceElectronicSystemsTECHAMERICAGEIA-HB-0007-A 2010.03.01 LogisticsProductDataHandbookTECHAMERICAGEIA-HB-649 2005.10.01 ImplementationGuideforConfigurationManagementTECHAMERICAGEIAHB-748-1 2004.05.01 Handbook:TheProgramManagers麓GuidetotheIntegratedBaselineReviewProcessTECHAMERICAGEIA-HB-859 2006.01.01 ImplementationGuideforDataManagementTECHAMERICAGEIA-HB-927 2007.07.01 ImplementationGuideforCommonDataSchemaforComplexSystemsTECHAMERICAGEIA-OP-0001-B 2006.05.01 ManualofOrganizationandProcedureTECHAMERICAGEIA-OP-0002 2002.02.01 StyleManualforStandardsandOtherPublicationsofGEIATECHAMERICAGEIA-SE-0001 2003.09.01 TheNextGenerationofSystemsEngineering:AReportbytheGEIAG-47SystemsEngineeringPanelTECHAMERICAGEIA-STD-0001 2005.10.01 IBISInterconnectModelingSpecificationTECHAMERICAGEIA-STD-0002-1 2005.08.01 AerospaceQualifiedElectronicComponent(AQEC)Requirements,Volume1鈥?IntegratedCircuitsandSemiconductorsTECHAMERICAGEIA-STD-0005-1 2006.06.01 PerformanceStandardforAerospaceandHighPerformanceElectronicSystemsContainingLead-freeSolderTECHAMERICAGEIA-STD-0005-2 2006.06.01 StandardforMitigatingtheEffectsofTinWhiskersinAerospaceandHighPerformanceElectronicSystemsTECHAMERICAGEIA-STD-0005-3 2008.06.01 PerformanceTestingforAerospaceandHighPerformanceElectronicInterconnectsContainingPb-freeSolderandFinishesTECHAMERICAGEIA-STD-0006 2008.07.01 RequirementsforUsingSolderDiptoReplacetheFinishonElectronicPiecePartsTECHAMERICAGEIA-STD-0007 2007.08.01 LOGISTICSPRODUCTDATA-Version01;IncludesAdditionalContentTECHAMERICAGEIA-STD-0009 2008.08.01 ReliabilityProgramStandardforSystemsDesign,Development,andManufacturingTECHAMERICAGEIA-STD-0010 2008.10.01 STANDARDBESTPRACTICESFORSYSTEMSAFETYPROGRAMDEVELOPMENTANDEXECUTIONTECHAMERICAGEIA-STD-927 2007.06.01 CommonDataSchemaforComplexSystems-IncludesAdditionalContentTECHAMERICAGEIA-STD-4899A 2007.11.01 StandardforPreparinganElectronicComponentsManagementPlanTECHAMERICAGEIA-TB-0002 2008.06.01 SystemConfigurationManagementImplementationTemplate(OrientedforaUSMilitaryContractEnvironment)TECHAMERICAGEIA-STD-0003 2006.01.01 LongTermStorageofElectronicDevices注：行業(yè)標(biāo)準(zhǔn)整套全部都可以提供，如需要訂購(gòu)單個(gè)標(biāo)準(zhǔn)，請(qǐng)聯(lián)系我們。聯(lián)系方式QQ：865686303 1134131839E-mail:china_isovip@126.com 本店收錄國(guó)內(nèi)外標(biāo)準(zhǔn)超過(guò)50萬(wàn)條，包括：國(guó)家標(biāo)準(zhǔn)，行業(yè)標(biāo)準(zhǔn)，部標(biāo)，國(guó)際標(biāo)準(zhǔn)，美國(guó)標(biāo)準(zhǔn)，歐洲標(biāo)準(zhǔn)，英國(guó)標(biāo)準(zhǔn)，德國(guó)標(biāo)準(zhǔn)，澳大利亞標(biāo)準(zhǔn)，日本標(biāo)準(zhǔn)GB，HB，GJB，EJ，HG，JB，ANSI，ASTM，AS/NZS，API，ASCE，ASME，BS，DIN，EN，IEEE，IEC，IPC，ISO，JIS，MIL，NACE，SAE，UL等等可為您提供的標(biāo)準(zhǔn)服務(wù)項(xiàng)目一、標(biāo)準(zhǔn)檢索和標(biāo)準(zhǔn)資料提供：　　根據(jù)客戶(hù)的需求提供標(biāo)準(zhǔn)號(hào)或標(biāo)準(zhǔn)名稱(chēng)檢索相關(guān)標(biāo)準(zhǔn)；如需訂購(gòu)標(biāo)準(zhǔn)可以提供標(biāo)準(zhǔn)資料.二、標(biāo)準(zhǔn)查新和標(biāo)準(zhǔn)有效性確認(rèn)：　根據(jù)客戶(hù)提供的標(biāo)準(zhǔn)號(hào)和標(biāo)準(zhǔn)名稱(chēng)對(duì)標(biāo)準(zhǔn)進(jìn)行查新和現(xiàn)行有效性確認(rèn)，并出具查新報(bào)告和有效性確認(rèn)報(bào)告。三、標(biāo)準(zhǔn)翻譯和標(biāo)準(zhǔn)代購(gòu)服務(wù)： 我們與世界知名的國(guó)外標(biāo)準(zhǔn)化組織，如ISO、IEC、BSI、JSA、DIN、ASTM、AS、IHSASME等30多個(gè)國(guó)家及國(guó)際標(biāo)準(zhǔn)化機(jī)構(gòu)保持著良好的業(yè)務(wù)合作與聯(lián)系，是30多個(gè)國(guó)家及國(guó)際標(biāo)準(zhǔn)化組織機(jī)構(gòu)在中國(guó)的分銷(xiāo)機(jī)構(gòu)。我們保證能以?xún)?yōu)惠的價(jià)格為用戶(hù)提供最優(yōu)質(zhì)的服務(wù)。國(guó)內(nèi)外標(biāo)準(zhǔn)互譯的服務(wù)。